FPC

Structure of product 2-LayersMaterial HI-TG CCL Min Pitch 0.1mm Min Line width 0.1mmMin Hole Diameter 0.15mmSurface finish Immersion Gold,Black standard glossy Application IC package,CCM module(BGA)

Stack up for rigid flex: 1-layer double-side + 2-layer single-side PCBBase material: 1mil PICCL: 1mil PI, 1/3oz adhesiveless, double ED copperCover layer: 1/2mil PI, 15um adhesive (2x)Minimum line width: 0.12mmMinimum line space: 0.07mmMinimum hole...

Application to Resistive Touch Panel

Stack up fmulti-layer FPC: 5-layer single-side + 1-layer ED copper foil Base material: 1/2mil PICCL: 1/2mil PI ,1/3oz adhesiveless,single side ED copperCover layer: 1/2mil PI, 15um adhesive (6x)Minimum line width: 0.076mmMinimum line space:...

Min Pitch0.05mm (2mil)Min Line width0.08mmMin Hole Diameter0.25mmSurface finishImmersion GoldApplicationIndustrial products, Instrument equipment

IC Substrate

Application to Industrial products, Instrument equipment

MaterialFCCL,CCL ,PI,Purity gum,Min Pitch0.1mm Min Line width0.1mmMin Hole Diameter0.3mmSurface finishImmersion Gold,green standard glossy ApplicationIndustrial products, Instrument equipment

MaterialFCCL,CCL ,PI,Purity gum,Min Pitch0.05mm (2mil)Min Line width0.08mmMin Hole Diameter0.25mmSurface finishImmersion Gold,green standard glossy ApplicationIndustrial products, Instrument equipment

Structure of product 4-Layers1+2+1Material FCCL,CCL ,PI,Purity gum,Min Pitch 0.1mm Min Line width 0.1mmMin Hole Diameter 0.3mmSurface finish Immersion Gold,green standard glossy Application Industrial products, Instrument equipment